Harnessing the Power of AI in Semiconductor

AI is shaping the development of the semiconductor industry. In four or more years, AI and machine learning will generate at least $85 billion in value annually for the semiconductor industry, accounting for about 20% of the current annual revenue, according to McKinsey (2021). AI is being comprehensively integrated into semiconductor design, manufacturing, and application processes, allowing us to tackle multifaceted challenges such as chip design, verification, defect detection, computational lithography, testing, operation/procurement, and software optimization for efficient chip utilization in various applications. The interplay between AI and the semiconductor industry is rapidly growing as AI revolutionizes the industry, drives innovation, and advances semiconductor technologies.

CASPA, as the world’s largest Chinese American semiconductor professional association, has organized this year's summer symposium in response to the trends.

Speakers

• Achin Bhowmik
  CTO & Executive VP of Engineering | Adjunct Professor, Stanford University
• Claudionor Coelho Jr
  Chief AI Officer and SVP of Engineering, Advantest
• Chloe Jian Ma
  Vice President, China GTM, ARM
• David Pan
  Professor, University of Texas Austin
• William Kou,
  VP Sales, Expedera
• Robert Blake, CEO of Achronix

Organized by the Chinese American Semiconductor Professional Association.

Co-sponsored by the UCSC Silicon Valley Extension VLSI and Semiconductor Engineering Program.