Units
3.0 QUARTER UNITS

Skills you will gain

  • 3D IC Packaging Fundamentals - Understand key concepts, benefits, and challenges of 3D IC technology.
  • Advanced Packaging Techniques - Explore architectures, materials, and fabrication processes.
  • Physical Verification & EMIR - Learn chip stacking verification and power integrity analysis.
  • Industry Trends & Innovations - Stay ahead with emerging technologies in 3D IC packaging.
  • Collaboration & Practical Application - Work in multidisciplinary teams on real-world projects.

Course Description


This course provides an in-depth exploration of the principles, techniques, and applications of three-dimensional integrated circuit (3D IC) packaging. 3D IC packaging is a cutting-edge technology that enables the stacking of multiple integrated circuits (ICs) within a single package, offering numerous advantages in terms of performance, power efficiency, and form factor.

The course begins with an introduction to the fundamentals of IC packaging, including various packaging technologies and their evolution. It then delves into the concepts and challenges associated with 3D IC packaging. Students will gain a comprehensive understanding of the design considerations, fabrication processes, and assembly techniques employed in 3D IC packaging. The course also covers topics like EMIR and has comprehensive physical verification in the areas of chip stacking.

Prerequisites / Skills Needed

 

Some familiarity with material science principles and a fundamental knowledge of semiconductor manufacturing processes. 

 

Additional Information

AI* - This course integrates AI by highlighting the hardware advances—such as hybrid bonding, high-density interconnects, and other enabling technologies—required to support high-speed data transmission for modern AI systems. 

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