To effectively design, analyze and compare different state-of-the-art memory interfaces, students start with an introduction to memory systems in computing devices such as computers, tablets or smartphones. They shift to an in-depth analysis of standard memory systems for low-power and high-performance applications and begin to discuss the interactions between signaling, clocking architecture and packaging technology of a memory interface.
- Review of the standard memory systems for workstations, desktop, laptop, tablets, and smartphones.
- The design challenges of low-power and high-performance memory interfaces
- The design and optimization of the signaling and clocking architectures, packaging solutions, channel, and power distribution system design
- The dependence of the memory channels on the system environments
- Channel attenuation, dispersion and reflection
- The traditional wirebond-based packaging technologies
- Advanced 2.5D/3D packaging technologies for memory solutions that use TSV technology and Si/Glass interposer for WideIO1 and WideIO2, hybrid memory cube (HMC) and high bandwidth memory (HBM) technologies are introduced.
- Analysis and comparison of different state-of-the-art memory interfaces
Skills Needed: Students must have a basic understanding of digital and analog circuits, signals and systems, computer architecture, and digital communication.